• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    PURPOSE: A wafer cooling apparatus of a heat exchange type is to extend a circulation passage of a cooling water to a wafer pedestal and thereby enhance the cooling efficiency of the wafer. CONSTITUTION: A wafer cooling apparatus comprises: a cathode(11) for radiating heat, the cathode having a cooling water passage(21a) formed at the inside thereof; and a wafer pedestal(13) that is installed on the cathode and on which a wafer is mounted, the wafer pedestal having a U-character shaped second cooling water passage(21b) formed at the inside thereof. The cathode is coupled to the wafer pedestal by an O-ring(25) such that the first cooling water passage communicates with the second cooling water passage. A packing(19) is provided at a coupled portion between the wafer pedestal and the cathode to prevent the cooling water from being leaked.
    公开号:KR20000021408A
    申请号:KR1019980040494
    申请日:1998-09-29
    公开日:2000-04-25
    发明作者:김형관
    申请人:윤종용；삼성전자 주식회사；
    IPC主号:
    专利说明:

    Wafer cooling apparatus using heat exchange
    The present invention relates to a wafer chiller. More specifically, the present invention relates to a cooling apparatus that increases the cooling efficiency of a wafer by installing a cooling water passage inside the wafer support.
    P-5000 equipment is a brand name for equipment used for dry etching in semiconductor manufacturing process. In the P-5000 facility, the wafer is placed on a wafer pedestal on the cathode, which is a high frequency (RF) heat dissipation unit, and the wafer must be cooled after the work is completed. Conventionally, cooling is performed using a heat exchanger. The heat exchanger circulates cooling water such as DI water in the cathode to cool the cathode body, and thus cools the wafer support to finally cool the wafer.
    Referring to FIG. 1, a wafer support 3 is provided on the cathode 1. The cathode 1 is provided with a water inlet 5 and a water outlet 7 which enter and circulate after the cooling water enters and circulates. There is a heat transfer film 9 between the cathode 1 and the wafer support 3.
    When the cathode 1 is cooled by the coolant circulating inside the cathode 1, the wafer support 3 is also cooled by the heat transfer film 9, and the wafer (not shown) on the wafer support is also cooled. Here, the heat transfer film 9 is made of a metal such as aluminum having good thermal conductivity.
    However, in the conventional method as described above, the cooling efficiency of the wafer is not very good. This is because the space where the cooling water circulates is substantially insufficient, and the cooling of the wafer depends on the exothermicity of the wafer support and the heat transfer film.
    Accordingly, an object of the present invention is to provide a wafer cooling apparatus that extends a passage through which cooling water circulates to the wafer support, thereby cooling the wafer support directly with the cooling water, thereby improving the cooling efficiency of the wafer.
    1 is a conceptual diagram showing a wafer cooling apparatus according to the prior art.
    2 is a conceptual diagram showing a wafer cooling apparatus according to the present invention.
    Figure 3 is a detailed view of the wafer cooling apparatus according to the present invention.
    <Description of Major Symbols in Drawing>
    1, 11: cathode 3, 13: wafer stand
    5, 15: inlet 7, 17: outlet
    9: heat transfer film 19: packing
    21a: first cooling water passage 21b: second cooling water passage
    23: screw 25: O-ring
    The present invention includes a cathode, which is a heat dissipating element, and a wafer support installed on a cathode, and a wafer supporter for circulating coolant into the cathode to cool the wafer, wherein a first cooling water passage is formed in the cathode. A second cooling water passage is formed in the wafer support, and the cathode and the wafer support are coupled to each other such that the first cooling water passage and the second cooling water passage penetrate each other.
    Preferably, a sealing packing is interposed between the cathode and the wafer support, and an opening contact between the first cooling water path and the second cooling water path is formed in an O-ring when the cathode and the wafer support are coupled to each other. It is good to be combined by.
    Embodiments of the present invention will be described in detail with reference to the drawings. 2 is a conceptual diagram of a wafer cooling apparatus according to the present invention, and FIG. 3 shows an actual implementation diagram. 2, it can be seen that the passage through which the coolant circulates extends not only to the cathode 11 but also to the inside of the wafer support 13. As a result, the wafer support 13 itself may be cooled by the coolant.
    With reference to Figure 3 will be described in more detail. The cathode 11 is formed by penetrating a first cooling water passage 21a in a straight line, and the wafer support 13 is formed by penetrating a U-shaped second cooling water passage 21b. When the cathode 11 and the wafer support 13 in which the cooling water passages are separately formed are assembled with the screws 23, the first and second cooling water passages 21a and 21b coincide with each other to allow one cooling water passage to pass through. Becomes
    At this time, the packing 19 is interposed between the wafer support 13 and the cathode 11 to prevent the cooling water from leaking out. The packing may be made of rubber or asbestos, which are generally used in plumbing equipment, and can be easily conceived by those skilled in the art.
    On the other hand, in order to make the openings of the cooling water passages close to each other, the openings of the cooling water passages are inserted with an O-ring in the middle and screwed with a screw 23.
    In this way, the cooling efficiency of the wafer can be much greater because the cooling water circulates directly to the cathode 11 body as well as inside the wafer support 13 on which the wafer is placed.
    As described above, according to the present invention, since the cooling water can be circulated to the inside of the wafer support, the cooling efficiency of the wafer is improved, thereby improving productivity and increasing yield.
    权利要求:
    Claims (3)
    [1" claim-type="Currently amended] A device for cooling a wafer by circulating cooling water into the cathode 11, including a cathode 11, which is a heat dissipating body, and a wafer support 13 installed on the cathode to place a wafer thereon.
    The first cooling water passage 21a is formed in the cathode 11,
    Inside the wafer support 13, a second cooling water passage 21b is formed,
    And a cathode and a wafer support so that the first cooling water passage and the second cooling water passage penetrate each other.
    [2" claim-type="Currently amended] The heat exchange type wafer cooling apparatus according to claim 1, wherein an airtight packing (19) is interposed between the cathode and the wafer support.
    [3" claim-type="Currently amended] The heat exchange wafer cooling apparatus according to claim 2, wherein the opening contact portions of the first cooling water passage and the second cooling water passage are joined by an O-ring 25 when the cathode and the wafer support are coupled to each other. .
    类似技术:
    公开号 | 公开日 | 专利标题
    US6377453B1|2002-04-23|Field replaceable module with enhanced thermal interface
    JP5486311B2|2014-05-07|Techniques for low temperature ion implantation.
    US7362574B2|2008-04-22|Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
    DE60131695T2|2008-11-13|An actively cooled distribution plate for reducing the temperature of the reactive gases in a plasma treatment system
    KR100432243B1|2004-05-22|Linear motor including cooling system
    DE10296733B4|2016-04-14|Cooling device for electric motor control unit
    US5095235A|1992-03-10|Vehicle ac generator
    JP3979143B2|2007-09-19|Cooling device for information processing equipment
    KR100806261B1|2008-02-22|Cooling jacket
    US8242644B2|2012-08-14|Arrangement for cooling of an electrical machine
    KR100317829B1|2001-12-22|Thermoelectric-cooling temperature control apparatus for semiconductor manufacturing process facilities
    KR100524831B1|2005-10-28|Processor and temperature control method therefor
    JP2012099825A|2012-05-24|Substrate support having dynamic temperature control
    KR100199218B1|1999-06-15|Test head cooling system
    US20060012958A1|2006-01-19|Electronic apparatus
    KR19990029347A|1999-04-26|Base station heat regulation system
    US20040068997A1|2004-04-15|Electrode cooler of processing device
    KR940011708B1|1994-12-23|Temperature control device for semiconductor wafer
    JP2004233791A|2004-08-19|Electronic equipment and refrigeration unit used therein
    CA2780658C|2019-08-06|Cooling device for a power module, and a related method thereof
    US7537048B2|2009-05-26|Integrated liquid cooling system for electronic components
    JP2006032890A|2006-02-02|Closed loop circulating radiator and screen module using same
    KR900002802B1|1990-04-30|Ac generator
    US7013959B2|2006-03-21|Integrated liquid cooling system for electrical components
    JP2004523127A|2004-07-29|Semiconductor device heat sink for liquid cooling power
    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1998-09-29|Application filed by 윤종용, 삼성전자 주식회사
    1998-09-29|Priority to KR1019980040494A
    2000-04-25|Publication of KR20000021408A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019980040494A|KR20000021408A|1998-09-29|1998-09-29|Wafer cooling apparatus of heat exchange type|
    [返回顶部]